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Yole Développement predicts high growth

Temporary bonding equipment market will see 5x growth in value 2011-2016

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IME and tMt strengthen MEMS expertise »
Singapore’s Institute of Microelectronics (IME) has announced JV with Touch Micro-System Technology (tMt),

NanoKTN announces second BlueSkyNano award scheme »
UK materials community encouraged to submit entries for research grants at ANSIN, Queen’s University Belfast

MEMS JV for EVG »
EV Group teams with Industrial Technology Research Institute (ITRI) on MEMS R&D

STMicro flexes MEMS muscle »
STMicroelectronics to further fuel motion-sensing revolution

Smart MEMS »
Mobile devices driving MEMS growth

MEMS misses earthquake pain »
Global MEMS industry is relatively unaffected from Japan quake aftermath

EVG’s award winning innovation for NIL technology »
Frost & Sullivan have awards EVG with its “2010 Technology Innovation Award“

Ferroelectric thin films report »
New MEMS applications are broadening the traditional scope of ferroelectric thin films

Piezo growth »
PI to invest $13 Million for extension of piezo ceramics factory 

3D integration bonding catch up »
SEMATECH reports advances in bond process for 3d integration development

Carbon nanotache with 3D Symmetry »
Researchers demonstrate skill with nano moustaches.

Advance material characterising »
Joint research development for 22nm and below devices

MEMS patent purchase »
Acacia Subsidiary acquires MEMS patents from Research Institute

HP leads the MEMS pack »
Hewlett-Packard maintains MEMS dominance in 2009

CMP delivery to Turkey »
Axus Technology delivers CMP and wafer thinning tools to the METU-MEMS Centre in Ankara

MEMS microphone to help voice recognition »
Analog Devices introduces new MEMS microphones

SPTS Begins 2010 Positively »
Solid Q1 Shipments of US$40M

Thales and Tronics in partnership for inertial MEMS »
Custom MEMS produced by Tronics to be used in Thales navigation systems for civil aircraft and defence applications

CEA-LETI purchases 300mm DRIE tool »
SPP/SPTS ships 300mm DRIE tool to CEA-LETI

Alchimer claim to remove entire TSV step »
New Alchimer seedless wet deposition technology eliminates entire step from TSV film stack process

STMicroelectronics plan MEMS microphone market expansion »
STMicroelectronics announce improved MEMS microphone technology

Report suggests growth in electroactive polymers »
Global electroactive polymers product market worth US$2.78 Billion by 2014

MEMS-Chip business to double by 2013 »
IC Insights reports on the growing pains of the global MEMS-Chip business.

SMIC qualifies MEMS chip »
SMIC announces successful qualification of a MEMS chip for Microstaq

Compound nanomaterial structures from Harvard »
Harvard scientists bend nanowires into 2-D and 3-D structures


 
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