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| NIL progress HamaTech MaskTrack system selected for NIL at Dai Nippon  |  |
| Mapping nano growth in the USA A recent update to a nanotechnology map of the USA shows every state now has a stake in the industry |  |
| A genetic future IBM scientists use DNA scaffolding to build tiny circuit boards |  |
| A billion reasons austriamicrosystems ships one billionth analogue IC for Knowles Acoustics’ MEMS microphones |  |
| Changing of the guard Peter Uddfors appointed as new CEO for Micronic Laser Systems AB |  |
| Lithography plans Toshiba selects Obducat NIL technology |  |
| Characterizing growth Rudolph Technologies acquires Adventa Control Technologies |  |
| Defining quantities Dolomite announces new capacity for electrophoresis chips |  |
| JV for 3D IC EV Group to collaborate with Applied Materials on thin wafer bonding technology for 3D IC development |  |
| Integrating 3D potential SOITEC announces collaboration with IBM to develop wafer level 3D integration technology |  |
| Bumping with nano light UGent and IMEC announce potentially show stopping results for future nano communication | |
| Bonding for 3D applications IMEC and SUSS MicroTec to collaborate on wafer bonding for 3D integration applications | |
| Nanoelectronic's partnership announced Novellus Systems and UAlbany NanoCollege launch $20 Million nanoelectronics R&D partnership. |  |
| Bonder for interconnect EV Group receives order for 300-mm wafer bonder from SEMATECH's 3D Interconnect Program at UAlbany NanoCollege |  |
| Display group joins research effort Uni-Pixel Displays joins the centre for advanced microelectronics manufacturing |  |
| Replicating success Replisaurus and Leti partner to push interconnect metallization technology towards commercialisation |  |
| MEMS on the rebound The Information Network releases report showing a return to health for the MEMS market |  |
| Alchimer raises $10 Million Funding helps meet continuing growth in demand | |
| Group effort on new ALD tool for MEMS ASM, MiPlaza and Holst Centre join forces on ALD for MEMS applications |  |
| Strengthening research SOI consortium welcome three more universities |  |
| New company from research centre Leti start up to provide improved cancer surgery | |
| DRIE win for STS STS wins DRIE tender at Fraunhofer ISIT | |
| Ultra thin and ready to go SOITEC state ultra thin SOI is ready for 22nm |  |
| New foundry opportunities RFMD announces availability of Gallium Nitride(GaN) foundry services |  |
| Player assessment Yole Développement;release report analysing the players in the MEMS market | |
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